Taiwan Semiconductor Manufacturing Company Ltd. (TSM)
342.30
+3.96 (1.17%)
NYSE · Last Trade: Jan 28th, 7:17 PM EST
Detailed Quote
Previous Close
338.34
Open
343.03
Bid
342.04
Ask
342.65
Day's Range
338.66 - 345.50
52 Week Range
134.25 - 351.33
Volume
12,126,684
Market Cap
8.88T
PE Ratio (TTM)
-
EPS (TTM)
-
Dividend & Yield
3.340 (0.98%)
1 Month Average Volume
14,298,471
Chart
About Taiwan Semiconductor Manufacturing Company Ltd. (TSM)
Taiwan Semiconductor Manufacturing Company (TSMC) is a leading semiconductor foundry that specializes in the production of advanced integrated circuits and microchips for various applications in technology sectors such as telecommunications, computing, and consumer electronics. The company operates state-of-the-art fabrication facilities and leverages cutting-edge manufacturing processes, enabling it to produce high-performance and energy-efficient chips. TSMC collaborates with a broad array of clients, including major technology firms, to support their innovation and growth by providing reliable and scalable chip manufacturing services. With a commitment to research and development, TSMC plays a critical role in advancing semiconductor technology, driving the digital transformation across multiple industries worldwide. Read More
The first month of 2026 has witnessed an unprecedented transformation in the global credit markets. In a historic rush to secure capital for the burgeoning "AI arms race," U.S. corporate bond issuance has shattered previous records, reaching a staggering $95 billion in the first full week of January alone.
The global technology landscape is undergoing a tectonic shift as the world’s largest "hyperscalers" abandon their traditional reliance on cash reserves to embrace a historic wave of debt financing. As of late January 2026, industry giants like Amazon.com Inc. (NASDAQ: AMZN) and Alphabet Inc. (NASDAQ: GOOGL) are leading
The transition from moving data via electricity to moving it via light—Silicon Photonics—has officially moved from the laboratory to the backbone of the world's largest AI clusters. By integrating optical engines directly into the processor package through Co-Packaged Optics (CPO), the industry is achieving a staggering 50% reduction in total networking energy consumption, effectively dismantling [...]
As of late January 2026, the semiconductor industry has reached a pivotal inflection point in the race for artificial intelligence supremacy. The transition to Backside Power Delivery Network (BS-PDN) technology—once a theoretical dream—has become the defining battlefield for chipmakers. With the recent high-volume rollout of Intel Corporation (NASDAQ: INTC) 18A process and the impending arrival [...]
As the artificial intelligence revolution accelerates into 2026, the semiconductor industry is undergoing its most significant material shift in decades. The traditional organic materials that have anchored chip packaging for nearly thirty years—plastic resins and laminate-based substrates—have finally hit a physical limit, often referred to by engineers as the "warpage wall." In response, industry leaders [...]
As of early 2026, the semiconductor landscape has reached a historic turning point, moving definitively away from the monolithic chip designs that defined the last fifty years. In their place, a new architecture known as 3.5D Advanced Packaging has emerged, powered by the Universal Chiplet Interconnect Express (UCIe) 3.0 standard. This development is not merely [...]
PHOENIX, AZ — January 28, 2026 — The "Silicon Desert" has officially bloomed. Marking the most significant shift in the global technology supply chain in four decades, the U.S. Department of Commerce today announced that the execution of the CHIPS and Science Act has reached its critical "High-Volume Manufacturing" (HVM) milestone. With over $30 billion [...]
HSINCHU, Taiwan — As the world enters the final week of January 2026, the semiconductor industry has officially crossed the threshold into the "Angstrom Era." Taiwan Semiconductor Manufacturing Company (NYSE: TSM), the world's most critical foundry, has formally announced the commencement of high-volume manufacturing (HVM) for its groundbreaking 2-nanometer (N2) process technology. This milestone does [...]
In a move that has sent shockwaves through the global semiconductor industry, NVIDIA (NASDAQ: NVDA) has officially confirmed a landmark dual-foundry strategy, marking a historic shift away from its exclusive reliance on TSMC (NYSE: TSM). According to internal reports and supply chain data as of January 2026, NVIDIA is moving the production of its critical [...]
In a move that signals a seismic shift in the semiconductor industry, Intel (NASDAQ: INTC) has officially transitioned its 18A process node into high-volume manufacturing (HVM) as of January 2026. This milestone marks the culmination of the company’s ambitious "five nodes in four years" strategy, positioning Intel at the vanguard of the 2nm-class era. The [...]
In a month defined by unprecedented policy pivots and high-stakes brinkmanship, the global semiconductor market has been plunged into a state of "logistical limbo." On January 14, 2026, the Trump administration shocked the tech world by granting NVIDIA (NASDAQ: NVDA) a formal license to export the H200 Tensor Core GPU to China—a move that initially [...]
In a move that signals a seismic shift in the artificial intelligence hardware landscape, Samsung Electronics (KRX: 005930) has officially announced it will begin mass production of its sixth-generation High Bandwidth Memory (HBM4) in February 2026. This milestone marks the culmination of a high-stakes "counterattack" by the South Korean tech giant to reclaim its dominant [...]
In a landmark moment for the global semiconductor industry, Taiwan Semiconductor Manufacturing Company (NYSE: TSM) has officially transitioned into high-volume manufacturing (HVM) for its 2-nanometer (N2) process technology as of January 2026. This milestone signals the dawn of the "Angstrom Era," moving beyond the limits of current 3nm nodes and providing the foundational hardware necessary [...]
As of January 28, 2026, the semiconductor industry has moved past the volatile "AI infrastructure build-out" phase of the early 2020s and into a sustained era of architectural revolution. At the heart of this transformation is Applied Materials, Inc. (Nasdaq: AMAT), the world’s largest provider of semiconductor manufacturing equipment. While lithography often captures the headlines, [...]
Introduction As of January 28, 2026, NVIDIA Corporation (NASDAQ: NVDA) stands not merely as a semiconductor company, but as the central nervous system of the global economy. With a market capitalization hovering between $4.5 trillion and $4.6 trillion, NVIDIA has eclipsed every other public entity in history. The company’s trajectory has shifted from providing the [...]
The semiconductor industry was sent into a tailspin this week as Intel Corp. (Nasdaq: INTC) reported fourth-quarter 2025 financial results that, while exceeding immediate expectations, painted a grim picture for the year ahead. Despite a revenue beat and a surprising jump in adjusted earnings for the final quarter of 2025,
As the global race for Artificial General Intelligence (AGI) accelerates, the infrastructure supporting these massive models has hit a physical "Copper Wall." Traditional electrical interconnects, which have long served as the nervous system of the data center, are struggling to keep pace with the staggering bandwidth requirements and power consumption of next-generation AI clusters. In [...]
As of January 2026, the scorched earth of Phoenix, Arizona, has officially become the most strategically significant piece of real estate in the global technology sector. Taiwan Semiconductor Manufacturing Company (NYSE: TSM), the world’s most advanced chipmaker, has successfully transitioned its Arizona "Gigafab" complex from a contentious multi-billion dollar bet into a high-yield production powerhouse. [...]
As of January 28, 2026, the artificial intelligence landscape has reached a critical hardware inflection point. The transition from generative chatbots to autonomous "Agentic AI"—systems capable of complex, multi-step reasoning and independent execution—has placed an unprecedented strain on global computing infrastructure. The answer to this crisis has arrived in the form of High Bandwidth Memory [...]
As of January 28, 2026, the global race for artificial intelligence dominance is no longer being fought solely in the realm of algorithmic breakthroughs or raw transistor counts. Instead, the front line of the AI revolution has moved to a high-precision manufacturing stage known as "Advanced Packaging." At the heart of this struggle is Taiwan [...]
The semiconductor industry has officially entered a new epoch. As of January 2026, the long-predicted "Glass Age" of chip packaging is no longer a roadmap item—it is a production reality. Intel Corporation (NASDAQ:INTC) has successfully transitioned its glass substrate technology from the laboratory to high-volume manufacturing, marking the most significant shift in chip architecture since [...]
As of January 2026, the global race for semiconductor supremacy has reached a fever pitch, centered on a massive, truck-sized machine that costs more than a fleet of private jets. ASML (NASDAQ: ASML) has officially transitioned its "High-NA" (High Numerical Aperture) Extreme Ultraviolet (EUV) lithography systems into high-volume manufacturing, marking the most significant shift in [...]
The global semiconductor landscape has officially crossed the 2-nanometer (2nm) threshold, marking the most significant architectural shift in computing in over a decade. As of January 2026, the long-anticipated race between Taiwan Semiconductor Manufacturing Company (NYSE:TSM), Samsung Electronics (KRX:005930), and Intel (NASDAQ:INTC) has transitioned from laboratory roadmaps to high-volume manufacturing (HVM). This milestone represents more [...]